2026 TSMC Domestic University JDP 提案徵求 Survey

教授您好，感謝您對台積公司2026 國內產學合作計畫(簡稱JDP)表達興趣。
請於8/21星期四(含)前回填下列表單，我們將依據您的回覆寄送相關資料供您參考。

※免責聲明:
1. 產學合作主題及其詳細資訊屬於台積電智慧財產，僅供有興趣之教授申請2026台積電產學合作計畫個人使用，不可移作其他用途。
2. 教授申請的產學合作計劃提案不可包含機密資訊，申請教授同意產學合作計劃提案不包含機密資訊，僅供台積電內部產學合作計畫審核使用。

若有任何問題，請聯繫：
yswangzw@tsmc.com 王小姐
cwchenbl@tsmc.com 陳小姐

姓名(必答。)

學校(必答。)

科系(必答。)

電子郵件信箱(學校信箱)(必答。)

辦公室/實驗室電話(必答。)

手機

研究專長/領域(必答。)

有興趣申請之JDP題目(可多選，至多三項)(必答。)

1. Low-R Metal Prediction and Identification for Advanced Node Scaling via AI/Machine Learning

2. AI-Driven Flow Field Simulation to Enhance MOL Metal ALD Filling Capabilities with Node scaling

3. New Work Function Metal Exploration through AI and Simulation: From Precursors to Film Properties

4. Resistivity Modeling for BEOL Interconnect: Novel Liner, Barrier, and Copper Alternative Materials

5. Wet Clean Chemical Solution to Photo Resist/Carbon-Fluorine Remove and Die Attach Tape Leaching Free

6. High Thermal Resistance Flux Material Development

7. Mechanisms and Methods of Plasma Pre-Treatment to Enhance Adhesion Between Si and Epoxy-Based Materials

8. Thin Film Mechanical Index Methodology JDP8. Thin Film Mechanical Index Methodology JDP

9. Development of a New Methodology for the Vertical Distribution of Key Components in the Tape Adhesive Layer

10. Using Multimodal AI and VLM (visual language model) to enhance Layout-Image interpretation

11. Trench bottom-up Silicon by flowable approach

12. Investigating the Correlation Between Chemical Bonding Architectures and Film Properties for Back-End-of-Line Interconnect Dielectric Materials

13. The study for Low forming voltage RRAM w/ high endurance & data retention performance

14. Layout-dependent thermal distribution model for reliability evaluation of electron migration

15. 2.5D Statistical Modeling of Interconnect Resistance/Capacitance

16. NMOS epitaxial process to boost device in GAAFET technology

17. Develop an advanced liquid particle counter capable of detecting both hard and soft particles in H2SO4/IPA raw materials.

18. Heterostructure ferroelectric/dielectric materials for CET optimization

19. Advanced Modeling and Optimization of Reactive Slurry Aging Effects on Material Removal Rate in Advanced Node CMP Processes

20. Reticle backside property and phenomenon with clamp interaction to avoid sticky behavior

21. Optimizing the application of nano-spray physical forces wet cleaning performance through adjustments to Liquid/N₂ flow rate.

22. EUV ellipsometry - polarization state generation and detection in EUV regime

23. Explore the possibility of using high-resolution cameras combined with AI image analysis to reduce noise in ECP, EBR, and CCD image judgment, achieve 365-degree monitoring, calculate EBR width and uniformity, enhance EBR defense, and replace the existing monitoring items.

24. Low Cap & Low Stress TSV for High-Speed Signal Usage

25. Holistic Analysis of LOFIC (Lateral Overflow Integration Capacitor) Design: Structural and Material Perspectives on High-k MIM Lag and Capacitance Performance.

26. Auto-generation of 2D gds-to-3D FEM model for fast stress simulation

27. X-ray and other radiation effect of GAA, FinFET and Back-side Power rail

28. The interface between electrode and oxide film in RRAM Units

29. N28 BEOL via process robustness study for reliability enhancement

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